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Inclusion of conductivity in silicon s.a.w. component design

Inclusion of conductivity in silicon s.a.w. component design

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An equivalent circuit is described for a surface-acoustic-wave delay line utilising interdigital transducers in a multilayered medium with a conductive silicon substrate. Attention is paid to practical material parameters for the ultimate realisation of the monolithic integration of surface-acoustic-wave and electronic components on the same silicon slice.


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