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Inclusion of conductivity in silicon s.a.w. component design

Inclusion of conductivity in silicon s.a.w. component design

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An equivalent circuit is described for a surface-acoustic-wave delay line utilising interdigital transducers in a multilayered medium with a conductive silicon substrate. Attention is paid to practical material parameters for the ultimate realisation of the monolithic integration of surface-acoustic-wave and electronic components on the same silicon slice.

References

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      • W.R. Smith , H.M. Gerard , J.H. Collins , T.M. Reeder , H.J. Shaw . Analysis of interdigital surface wave transducers by use of an equivalent circuit model. IEEE Trans. , 856 - 864
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      • A. Venema , R.F. Humphryes . A model for SAW transduction on silicon. Appl. Phys.
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      • A. Venema , J.J.M. Dekkers , R.F. Humphryes . Static capacitance calculations for a surface acoustic wave interdigital transducer in multi-layered media. IEEE Trans.
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      • Gerard, H., Wauk, M., Weglein, R.: `Large time bandwidth product microwave delay line', ECON-03852, Technical Report, .
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