© The Institution of Electrical Engineers
An important new family of acoustic wave devices is described which has the simplicity, versatility and planar construction of s.a.w. devices, together with the attractive properties of bulk-wave devices, including high velocity, low attenuation, good temperature stability and insensitivity to surface contamination.
References
-
-
1)
-
R. Stein
.
(1966)
IEEE Trans..
-
2)
-
M.F. Lewis
.
Ultrasonics.
Ultrasonics
,
115 -
123
-
3)
-
R.S. Wagers
.
(1976)
IEEE Trans..
-
4)
-
Mitchell, R.F.: IEEE Catalogue 74 CHO 896–ISU, Proceedings of IEEE ultrasonics symposium, 1974, p. 313–320.
-
5)
-
R.M. White ,
F.W. Voltmer
.
Appl. Phys. Lett..
Appl. Phys. Lett.
,
314 -
316
-
6)
-
Lewis, M.F.: 1451326; 3950713, , UK Patent; USA Patent.
-
7)
-
Lewis, M.F.: Unpublished work, reported to the UK s.a.w. liaison meeting, January 1973.
-
8)
-
Mortley, W.: 988102, 1962, UK Patent.
-
9)
-
D.P. Morgan
.
(1976)
, S.A.W. passive interdigital devices.
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19770091
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