access icon free Design of highly reliable energy-efficient SEU tolerant 10T SRAM cell

A novel energy-efficient radiation hardened by design 10T static RAM (SRAM) cell is proposed. The parasitic extracted simulations show that by employing the proposed 10T-SRAM cell, an average improvement of ∼ 29, 5/10%, and 108/129%, in layout area, write/read access time (WAT/RAT), and write/read static noise margin (WSNM/RSNM), respectively, is obtained over the recently reported 10T-SRAM cell at a supply voltage 0.4 V in STMicroelectronics 65 nm technology. The proposed SRAM cell at 32 nm technology node using technology computer-aided design mixed-mode simulations is also validated. In 32 nm technology, the proposed SRAM cell shows 42/125% and 54/8%, in WSNM/RSNM and WAT/RAT, respectively, better results as compared with 10T SRAM cell at a supply voltage 0.3 V. In 32 nm technology, the proposed SRAM cell can mitigate the impact of heavy-ion strike with a linear energy transfer of 30 MeV cm2/mg.

Inspec keywords: integrated circuit reliability; SRAM chips; energy conservation; radiation hardening (electronics); integrated circuit layout

Other keywords: technology node; size 32.0 nm; voltage 0.4 V; technology computer-aided design mixed-mode simulations; STMicroelectronics technology; linear energy transfer; write-read access time; heavy-ion strike mitigation; WAT-RAT; parasitic extracted simulations; WSNM-RSNM; layout area; novel energy-efficient radiation hardened by design 10T static RAM cell; write-read static noise margin; voltage 0.3 V; highly reliable energy-efficient SEU tolerant 10T SRAM cell design; size 65.0 nm

Subjects: Electrical/electronic equipment (energy utilisation); Radiation effects (semiconductor technology); Reliability; Semiconductor storage; Semiconductor integrated circuit design, layout, modelling and testing; Memory circuits

References

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      • 1. Kaul, H., Andres, M., Hsu, S., et al: ‘Near-threshold voltage (NTV) design opportunities and challenges’. IEEE Design Automation Conf., San Francisco, CA, USA, June 2012, pp. 11491154.
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http://iet.metastore.ingenta.com/content/journals/10.1049/el.2018.7267
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