References

• 1. 1)
     • 2. Han, J.Z., Liao, X.P.: ‘Analytical and electrical modeling of a MEMS thermoelectric microwave power sensor’, J. Micromech. Microeng., 2016, 26, (9), doi: 10.1088/0960-1317/26/9/094001.
  2. 2)
     • 5. Yi, Z.X., Yan, H., Liao, X.P.: ‘Theoretical and experimental investigation of cascaded microwave power sensor’, Trans. Electron Devices, 2017, 64, (4), pp. 1728–1734 (doi: 10.1109/TED.2017.2665458).
  3. 3)
     • 7. Herwaarden, A.W.V., Sarro, P.M.: ‘Thermal sensors based on the Seebeck effect’, Sens. Actuators, 1986, 10, (3), pp. 321–346 (doi: 10.1016/0250-6874(86)80053-1).
  4. 4)
     • 2. Scott, J.B., Low, T.S., Cochran, S., Keppeler, B., Staroba, J., Yeats, B.: ‘New thermocouple-based microwave/millimeter-wave power sensor MMIC techniques in GaAs’, IEEE Trans. Microw. Theory Tech.,2011, 59, (2), pp. 338–344 (doi: 10.1109/TMTT.2010.2087346).
  5. 5)
     • 3. Zhang, Z.Q., Liao, X.P.: ‘Characteristics of doped n + GaAs thermopile-based RF MEMS power sensors for MMIC applications’, Trans. Electron Devices., 2017, 38, (10), p. 99, doi: 10.1109/LED.2017.2747142.
  6. 6)
     • 8. Wang, D.B., Liao, X.P., Liu, T.: ‘A thermoelectric power sensor and its package based on MEMS technology’, J. Microelectromech. Syst., 2012, 21, (1), pp. 121–131 (doi: 10.1109/JMEMS.2011.2174417).
  7. 7)
     • 4. Wang, D.B., Liao, X.P., Liu, T.: ‘Optimization of indirectly-heated type microwave power sensors based on GaAs micromachining’, Sens. J., 2012, 12, (5), pp. 1349–1355 (doi: 10.1109/JSEN.2011.2170677).
  8. 8)
     • 6. Zhang, Z.Q., Guo, Y., Li, F., et al: ‘A sandwich-type thermoelectric microwave power sensor for GaAs MMIC-compatible applications’, Electron Device Lett., 2016, 37, (12), pp. 1639–1641 (doi: 10.1109/LED.2016.2619380).