http://iet.metastore.ingenta.com
1887

MEMS microwave power sensor with thermovoltage compensation and transformation

MEMS microwave power sensor with thermovoltage compensation and transformation

For access to this article, please select a purchase option:

Buy article PDF
$19.95
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

An MEMS microwave power sensor with thermovoltage compensation and transformation is presented. The sensor obtains a thermovoltage which is linear to the input power, thanks to the Seebeck effect. However, the thermovoltage decreases as the frequency of input power increases due to the loss. The novelty is that the variation of thermovoltage has been compensated by an algorithm, and a transformation line is obtained to transform the thermovoltage to measured power displayed on liquid crystal display. The result indicates that the relative error is smaller than 1.5%. This system has practical applications in precise power measuring instruments.

References

    1. 1)
    2. 2)
      • 2. Han, J.Z., Liao, X.P.: ‘Analytical and electrical modeling of a MEMS thermoelectric microwave power sensor’, J. Micromech. Microeng., 2016, 26, (9), doi: 10.1088/0960-1317/26/9/094001.
    3. 3)
      • 3. Zhang, Z.Q., Liao, X.P.: ‘Characteristics of doped n + GaAs thermopile-based RF MEMS power sensors for MMIC applications’, Trans. Electron Devices., 2017, 38, (10), p. 99, doi: 10.1109/LED.2017.2747142.
    4. 4)
    5. 5)
    6. 6)
    7. 7)
    8. 8)
http://iet.metastore.ingenta.com/content/journals/10.1049/el.2018.0299
Loading

Related content

content/journals/10.1049/el.2018.0299
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
Correspondence
This article has following corresponding article(s):
in brief
This is a required field
Please enter a valid email address