access icon free Predicted and measured temperature compensated surface acoustic wave devices for high-temperature applications

Industrial monitoring and process control, power plants, aerospace industry, military equipment manufacturing, oil and gas industries are examples of businesses in need for high-temperature and harsh-environment electronic components and systems. In particular, resonators and filters that operate beyond the 125°C military range upper limit, normally dictated by silicon-based semiconductor devices, are required in applications which demand frequency control, clocking and sensors. In this Letter, temperature compensated surface acoustic wave orientations appropriate for the fabrication of resonators and filters >125°C have been identified through numerical calculations and experimentally confirmed on a commercially available langasite wafer, a piezoelectric crystal which operates at high temperatures. Resonator filters have been designed, fabricated and tested along two orientations, confirming the zero temperature sensitivities at 150 and 300°C. These devices are of great interest for modern harsh environment frequency control, timing and sensor applications.

Inspec keywords: frequency control; high-temperature electronics; numerical analysis; resonator filters; surface acoustic wave filters; sensors

Other keywords: timing applications; sensor applications; high-temperature applications; numerical calculations; temperature compensated surface acoustic wave orientations; silicon-based semiconductor devices; frequency control; electronic components; clocking; harsh environments; temperature compensated surface acoustic wave devices; langasite wafer; piezoelectric crystal; resonator filters

Subjects: Other numerical methods; Sensing devices and transducers; Acoustic wave devices; Passive filters and other passive networks; Waveguide and microwave transmission line components

References

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      • 2. Pereira da Cunha, M.: ‘Wireless sensing in hostile environments’. Joint UFFC, EFTF and PFM Symp. 2013, Prague, Czech Republic, July 2013, pp. 13371346, doi: 10.1109/ULTSYM.2013.0342.
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