The fabrication of a flexible electronic system which consists of a flexible polyimide (PI) substrate and a rigid silicon thin chip is demonstrated. The 50 μm thick rigid silicon chips are bonded to the PI substrate using a die attach film (20 μm) and electrically interconnected to an adjacent metal pad which is deposited on the PI substrate and silicon chips. A 3D step covered interconnection consisted of silver nanoparticles and polymer are achieved by using an electrohydrodynamic system. The mechanical and electrical characteristic was investigated by performing a Kelvin resistance measurement on the jetted lines while the substrate was subjected to bending modes of varying diameters.