access icon free Built-in parasitic-diode-based charge injection technique enhancing data retention of gain cell DRAM

A gain cell embedded dynamic random access memory (eDRAM) with a noble charge injection technique is presented. The gain memory cell is composed of dual-threshold two logic N-type MOSs implemented in a generic triple-well CMOS process. A negative-voltage toggle on the parasitic junction diode formed between the pocket p-well and the cell data node couples up the cell storage voltages. It results in a much enhanced retention time in a compact bit area. Moreover, the technique exhibits much strong immunity from the write disturbance. Measured results at 85°C from a 110 nm 64 kbit prototype eDRAM incorporating the proposed technique demonstrate 69% enhanced retention time and 86% smaller write disturbance loss compared with the conventional one.

Inspec keywords: semiconductor diodes; DRAM chips; charge injection; CMOS memory circuits

Other keywords: built-in parasitic diode; eDRAM; data retention enhancement; size 110 nm; storage capacity 64 Kbit; gain cell embedded dynamic random access memory; charge injection technique; temperature 85 C; triple well CMOS process; parasitic junction diode; gain cell DRAM; negative-voltage toggle; write disturbance immunity

Subjects: Memory circuits; Semiconductor storage; CMOS integrated circuits; Junction and barrier diodes

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http://iet.metastore.ingenta.com/content/journals/10.1049/el.2015.2237
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