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Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

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The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

References

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      • 1. http://www.ieee802.org/3/400GSG/.
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      • 3. Simoyama, T., Matsuda, M., Okumura, S., Uetake, A., Ekawa, M., Yamamoto, T.: ‘50-Gbps direct modulation using 1.3-μm AlGaInAs MQW distribute-reflector lasers’. Proc. ECOC, Amsterdam, Netherlands, September 2012, P2.11.
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      • 5. Tatsumi, T., Tanaka, K., Sawada, S., Fujita, H., Abe, T.: ‘1.3 μm, 56-Gbit/s EML module target to 400GbE’. Proc. OFC, California, USA, March 2012, OTh3F.4.
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http://iet.metastore.ingenta.com/content/journals/10.1049/el.2013.4276
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