Your browser does not support JavaScript!
http://iet.metastore.ingenta.com
1887

Thin MEMS microphone based on package-integrated fabrication process

Thin MEMS microphone based on package-integrated fabrication process

For access to this article, please select a purchase option:

Buy article PDF
$19.95
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

A thin capacitive-type MEMS acoustic sensor fabricated using a fully package-integrated process is presented. This sensor has a very slim thickness of 150 µm due to the elimination of the complicated back-side alignment process which requires a thickness of more than 400 µm to prevent the substrate from breaking down. In addition, a structure-based equivalent circuit modelling was performed to evaluate the characteristics of the proposed microphone. The measured initial gap was 2.8 µm, which resulted in an intrinsic capacitance of 0.89 pF and the natural frequency was 83 kHz. The sensor has an open-circuit sensitivity of −47.7 dBV/Pa at 1 kHz with 10.4 V. The modelled sensitivity shows good agreement with the measured sensitivity.

References

    1. 1)
    2. 2)
      • Lee, J., Je, C.H., Jeon, J.H., Yang, W.S., Kim, J.: `A surface micromachined MEMS acoustic sensor with back-plate anchors of 100 µm depth', IEEE 2011 Sensor Conf., October 2011, Ireland, p. 1978–1981.
    3. 3)
    4. 4)
    5. 5)
http://iet.metastore.ingenta.com/content/journals/10.1049/el.2012.1781
Loading

Related content

content/journals/10.1049/el.2012.1781
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
This is a required field
Please enter a valid email address