Low resistance Ti/Al/Au ohmic backside contacts to nonpolar m-plane n-GaN

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Low resistance Ti/Al/Au ohmic backside contacts to nonpolar m-plane n-GaN

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An effective surface treatment method has been developed to realise low resistance ohmic contacts on the lapped backsides of m-plane n-GaN substrates with a moderate doping level of 5.5×1017 cm−3. Ti/Al/Au contacts with fine polishing and an ICP treatment followed by annealing at 700°C for 5 min yielded a specific contact resistance as low as 3.9×10−5 Ωcm2. The same low specific contact resistance was also achieved by annealing at 500°C for 5 min on a relatively rough surface. The effective removal of the lapping damage by ICP treatment and the creation of nitrogen vacancies during annealing are believed to improve the contacts.

Inspec keywords: surface treatment; ohmic contacts; semiconductor doping; annealing; contact resistance

Other keywords: m-plane n-GaN substrates; ohmic backside contacts; contact resistance; surface treatment; moderate doping level; Ti-Al-Au; annealing; ICP treatment

Subjects: Semiconductor-metal interfaces; Electrical contacts; Semiconductor doping; Surface treatment (semiconductor technology); Annealing processes in semiconductor technology

References

    1. 1)
      • L.L. Smith , R.F. Davis , R.-J. Liu , M.J. Kim , R.W. Carpenter . Microstructure, electrical properties, and thermal stability of Ti-based ohmic contacts to n-GaN. J. Mater. Res. , 1032 - 1038
    2. 2)
      • D.K. Schroder . (2005) Semiconductor material and device characterization.
    3. 3)
    4. 4)
      • R.H. Cox , H. Strack . Ohmic contacts for GaAs devices. Solid-State Electron. , 1213 - 1218
    5. 5)
      • L. Wang , F.M. Mohammed , I. Adesida . Characterization of Au and Al segregation layer in post-annealed thin Ti/Al/Mo/Au ohmic contacts to n-GaN. J. Appl. Phys.
    6. 6)
      • K. Okamoto , J. Kashiwagi , T. Tanaka , M. Kubota . Nonpolar m-plane InGaN multiple quantum well laser diodes with a lasing wavelength of 499.8 nm. Appl. Phys. Lett.
    7. 7)
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