Normally-off operation AlGaN/GaN MOS-HEMT with high threshold voltage

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Normally-off operation AlGaN/GaN MOS-HEMT with high threshold voltage

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Normally-off operation AlGaN/GaN high electron mobility transistors have been developed utilising a fluorine-based treatment technique combined with a metal-oxide-semiconductor gate architecture. Threshold voltage as high as 5.1 V was achieved by using an 16 nm-thick Al2O3 gate oxide film. Additionally, the device performed a drain current density of 500 mA/mm and a peak transconductance of 100 mS/mm, which are comparable to the conventional normally-on devices.

Inspec keywords: MOSFET; gallium compounds; high electron mobility transistors; aluminium compounds; III-V semiconductors

Other keywords: metal-oxide-semiconductor gate architecture; fluorine-based treatment technique; normally-off operation MOS-HEMT; Al2O3; high electron mobility transistors; size 16 nm; voltage 5.1 V; AlGaN-GaN

Subjects: Insulated gate field effect transistors; II-VI and III-V semiconductors

References

    1. 1)
    2. 2)
      • T. Mizutani , M. Ito , S. Kishimoto , F. Nakamura . AlGaN/GaN HEMTs with thin InGaN cap layer for normally off operation. IEEE Electron Device Lett. , 7 , 549 - 551
    3. 3)
    4. 4)
      • T. Ohki , T. Kikkawa , M. Kanamura , K. Imanishi , K. Makiyama , N. Okamoto , K. Joshin , N. Hara . An over 100W AlGaN/GaN enhancement-mode HEMT power amplifier with piezoelectric-induced cap structure. Phys. Status Solidi C , 6 , 1365 - 1368
    5. 5)
      • M. Kodama , M. Sugimoto , E. Hayashi , N. Soejima , O. Ishiguro , M. Kanechika , K. Itoh , H. Ueda , T. Uesugi , T. Kachi . GaN-based trench gate metal oxide semiconductor field-effect transistor fabricated with novel wet etching. Appl. Phys. Express , 2
    6. 6)
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