Si-based packaging platform for LED module using electroplating method

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Si-based packaging platform for LED module using electroplating method

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Published

A method for fabricating a Si-based packaging platform with a reflector and electrode-guided interconnections is proposed for the packaging component of a high-power light-emitting diode (LED) module. The reflector is fabricated by Ni/Au/Ag-electroplating which is patterned by SU-8 2075 and 4620 negative photo-resistors and the electrical interconnections are formed by Cu/Au-electroplating in the same body. The heat generated by the LED chip is dissipated directly to the Si body through the large metal-plated platform. This method is suitable for high-efficiency and low-cost LED packaging.

Inspec keywords: electroplating; electronics packaging; elemental semiconductors; silicon; light emitting diodes; photoresistors; semiconductor device metallisation

Other keywords: electroplating method; electrical interconnections; LED module; electrode-guided interconnections; negative photoresistors; packaging platform; high-power light-emitting diode module; reflector

Subjects: Product packaging; Photoelectric devices; Light emitting diodes; Metallisation and interconnection technology

References

    1. 1)
      • C.F. Tsou , Y.S. Huang . Silicon-based packaging platform for light-emitting diode. IEEE Trans. Adv. Packag. , 3 , 607 - 614
    2. 2)
      • D.Y. Kang , E. Wu , D.M. Wang . Modeling white light-emitting diodes with phosphor layers. Appl. Phys. Lett. , 23
    3. 3)
http://iet.metastore.ingenta.com/content/journals/10.1049/el.2010.1798
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