http://iet.metastore.ingenta.com
1887

Partial uniplanar compact electromagnetic bandgap combined with high-impedance surface to suppress simultaneous switching noise

Partial uniplanar compact electromagnetic bandgap combined with high-impedance surface to suppress simultaneous switching noise

For access to this article, please select a purchase option:

Buy article PDF
$19.95
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

Proposed is a design for a partial uniplanar compact electromagnetic bandgap (UC-EBG) structure, in conjunction with a high-impedance surface (HIS), to suppress simultaneous switching noise (SSN) over the wide frequency range 0.38–15.494 GHz. Different from the conventional methods, which use an EBG plane, the proposed structure uses only two UC-EBGs at the excitation and receiving ports to suppress SSN. This technique can be applied to sensitive circuits to maintain their power integrity. The other region maintains good signal integrity when a signal return path is referenced to an EBG plane.

References

    1. 1)
      • Jun, L., Cheng, L.: `Ground bounce noise isolation with power plane segmentation in system-in-package (SiP)', Int. Conf. on Microw. and Millimeter Wave Tech., 2007, p. 1–4.
    2. 2)
      • W. Cui , J. Fan , Y. Ren , H. Shi , J.L. Drewniak , R.E. DuBroff . DC power-bus noise isolation with power-plane segmentation. IEEE Trans. Electromagn. Compat. , 2 , 436 - 443
    3. 3)
      • J.H. Kwon , D.U. Shim , S.I. Kwak , J.G. Yook . Partial placement of electromagnetic bandgap unit cells to effectively mitigate simultaneous switching noise. Electron. Lett. , 22 , 1302 - 1303
    4. 4)
      • Q. Jie , O.M. Ramahi , V. Granatstein . Novel planar electromagnetic bandgap structures for mitigation of switching noise and EMI reduction in high-speed circuits. IEEE Trans. Electromagn. Compat. , 3 , 661 - 669
    5. 5)
      • M.S. Zhang , Y.S. Li , C. Jia , L.P. Li . Signal integrity analysis of the traces in electromagnetic-bandgap structure in high-speed printed circuit boards and packages. IEEE Trans. Microw. Theory Tech. , 5 , 1054 - 1062
    6. 6)
      • C.S. Chang , M.P. Houng , D.B. Lin , K.C. Hung , I.T. Tang . Simultaneous switching noise mitigation capability with low parasitic effect using aperiodic high-impedance surface structure. Prog. Electromagn. Res. Lett. , 149 - 158
http://iet.metastore.ingenta.com/content/journals/10.1049/el.2009.1133
Loading

Related content

content/journals/10.1049/el.2009.1133
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
This is a required field
Please enter a valid email address