A numerical simulation of frosting and condensation in aviation electronic devices based on nielsen dynamic frosting model
A numerical simulation of frosting and condensation in aviation electronic devices based on nielsen dynamic frosting model
For access to this article, please select a purchase option:
Buy conference paper PDF
Buy Knowledge Pack
IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.
Thank you
Your recommendation has been sent to your librarian.
- Author(s): R. Shi 1 ; W. Chen 1 ; C. Li 1 ; X. Han 1 ; Q. Cheng 1
-
-
View affiliations
-
Affiliations:
1:
Key Laboratory of Aircraft environment control and life support , Ministry of Industry and Information Technology, Nanjing University of Aeronautics & Astronautics Nanjing, P.R. China
Source:
CSAA/IET International Conference on Aircraft Utility Systems (AUS 2020),
2021
p.
1249 – 1254
-
Affiliations:
1:
Key Laboratory of Aircraft environment control and life support , Ministry of Industry and Information Technology, Nanjing University of Aeronautics & Astronautics Nanjing, P.R. China
- Conference: CSAA/IET International Conference on Aircraft Utility Systems (AUS 2020)
- DOI: 10.1049/icp.2021.0341
- ISBN: 978-1-83953-419-5
- Location: Online Conference
- Conference date: 18-21 September 2020
- Format: PDF
Moist air frosting is a complex process, and static model is difficult to meet the requirements of engineering practice. Therefore, it is very necessary to establish dynamic frosting model. In this paper, the existing frost model has been modified reasonably, the dynamic frost growth model has been established and the dynamic simulation of frost model has been carried out. The influence of moist air temperature on the cold plate temperature change process, frosting weight and condensed water weight has been obtained. On this basis, the frosting and condensation characteristics of the internal components of the aviation electronic devices are simulated and calculated. The calculation shows that the frosting weight and condensed water weight in the aviation electronic devices are arranged in the following order: circuit board, lower board, upper board, front board, side board 2, side board 1, and rear board. Therefore, at the same temperature of moist air, the components where frost and condensed water are most likely to occur inside the aviation electronic devices is near the inlet, which is also the location where the weight of frosting and condensed water is the largest.
Inspec keywords: freezing; mass transfer; plates (structures); heat transfer; ice; condensation; heat exchangers; numerical analysis
Subjects: Engineering materials; Applied fluid mechanics; Flows in ducts, channels, and conduits; Heat and thermodynamic processes (mechanical engineering); General shapes and structures; Fluid mechanics and aerodynamics (mechanical engineering)