Numerical calculation of temperature rise on gas-insulated busbar contacts based on contacts bridge model and multi-physics coupling method
Numerical calculation of temperature rise on gas-insulated busbar contacts based on contacts bridge model and multi-physics coupling method
- Author(s): H. Li 1 ; S. Chen 1 ; F. Tao 1 ; S. Gao 1 ; K. Zhao 1 ; X. Jia 2
- DOI: 10.1049/icp.2020.0271
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- Author(s): H. Li 1 ; S. Chen 1 ; F. Tao 1 ; S. Gao 1 ; K. Zhao 1 ; X. Jia 2
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View affiliations
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Affiliations:
1:
State Grid Jiangsu Electric Power Company Research Institute , Nanjing , China ;
2: State Grid Jiangsu Electric Power Maintenance Company , Nanjing , China
Source:
The 16th IET International Conference on AC and DC Power Transmission (ACDC 2020),
2021
p.
1689 – 1696
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Affiliations:
1:
State Grid Jiangsu Electric Power Company Research Institute , Nanjing , China ;
- Conference: The 16th IET International Conference on AC and DC Power Transmission (ACDC 2020)
- DOI: 10.1049/icp.2020.0271
- ISBN: 978-1-83953-330-3
- Location: Online Conference
- Conference date: 02-03 July 2020
- Format: PDF
Numerical simulation is an effective way to study the temperature rise characteristics which directly affect the overheating of GIB (Gas-Insulated Busbar). In order to calculate the temperature of bus contact accurately, a conductive bridge model is introduced to simulate the current contraction effect and joule heat effect between conductor and contact fingers in the model formation stage. Direct and indirect coupling methods are combined to build the 3-D eddy current-fluid-thermal finite element calculation model. Temperatures of the GIB contact under different currents and ambient temperatures are separately calculated with the proposed model. Temperature rise tests on GIB prototype are carried out to verify the correctness of the numerical calculation model and the reasonableness of conductive bridge equivalent treatment.
Inspec keywords: finite element analysis; eddy currents; busbars; numerical analysis; electrical contacts
Subjects: Mechanical components; Finite element analysis; Electromagnetic induction; Numerical approximation and analysis; Numerical analysis