Your browser does not support JavaScript!
http://iet.metastore.ingenta.com
1887

Boundary condition adaptive thermal compact models for multi-cooling surfaces and multi-heat sources power packages

Boundary condition adaptive thermal compact models for multi-cooling surfaces and multi-heat sources power packages

For access to this article, please select a purchase option:

Buy conference paper PDF
£12.50
(plus tax if applicable)
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
9th International Seminar on Power Semiconductors (ISPS 2008) — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

Inspec keywords: pyroelectricity; electronics packaging; cooling; power electronics

Subjects: Power electronics, supply and supervisory circuits; Product packaging

Related content

content/conferences/10.1049/ic_20080193
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
This is a required field
Please enter a valid email address