Boundary condition adaptive thermal compact models for multi-cooling surfaces and multi-heat sources power packages
Boundary condition adaptive thermal compact models for multi-cooling surfaces and multi-heat sources power packages
- Author(s): P. Tounsi ; F. Madrid ; W. Habra ; J. Nowakowski
- DOI: 10.1049/ic:20080193
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- Author(s): P. Tounsi ; F. Madrid ; W. Habra ; J. Nowakowski Source: 9th International Seminar on Power Semiconductors (ISPS 2008), 2008 p. 195 – 200
- Conference: 9th International Seminar on Power Semiconductors (ISPS 2008)
- DOI: 10.1049/ic:20080193
- ISBN: 978-80-01-04139-0
- Location: Prague, Czech Republic
- Conference date: 27-29 Aug. 2008
- Format: PDF
As power component manufacturers may not wish to publish confidential information about their technology, automotive system engineers are lacking in technical information for thermal design optimization. The device structure and material data information is particularly significant for electrothermal coupling, to generate correct and reliable Compact Thermal Model (CTM). Several innovations in methodologies for power components manufacturers are proposed in this paper, in order to accurately generate CTM.
Inspec keywords: pyroelectricity; electronics packaging; cooling; power electronics
Subjects: Power electronics, supply and supervisory circuits; Product packaging
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