The future of silicon design

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The future of silicon design

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  • DOI:  10.1049/ic:20050593
  • ISBN: 0-86341-561-X
  • Location: London, UK
  • Conference date: 14-15 Sept. 2005
  • Format: PDF
A collection of slides from the author's conference presentation is given. (7 pages)

Inspec keywords: integrated circuit design; system-in-package; technological forecasting; system-on-chip; silicon

Subjects: Semiconductor integrated circuit design, layout, modelling and testing

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