Influence of configurations of chamber and coil on uniformity of plasma distribution for inductively coupled plasma etcher
Influence of configurations of chamber and coil on uniformity of plasma distribution for inductively coupled plasma etcher
- Author(s): Cheng Jia and Zhu Yu
- DOI: 10.1049/cp:20060928
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- Author(s): Cheng Jia and Zhu Yu Source: International Technology and Innovation Conference 2006 (ITIC 2006), 2006 p. 1113 – 1117
- Conference: International Technology and Innovation Conference 2006 (ITIC 2006)
- DOI: 10.1049/cp:20060928
- ISBN: 0 86341 696 9
- Location: Hangzhou, China
- Conference date: 6-7 Nov. 2006
- Format: PDF
Based on the modules of plasma and electromagnetic field etc. in the commercial software, CFD-ACE+, a two-dimensional discharge model of an inductively coupled plasma (ICP) etcher was built. The spatial distributions of the electron temperature-Te and the electron number density-Ne of the argon plasma were simulated at 10 mTorr, 200 W and 200 secm. One-dimensional distributions profile of the plasma parameters above the wafer's surface for the different chambers and coils were compared. These results demonstrate that the uniformity of the plasma distribution is improved with the height of the chamber and the radius of the coil, and a little enhanced by the modification of the chamber. This study provides the valuable references to design and modify the chamber and the coil for the ICP equipments.
Inspec keywords: computational fluid dynamics; plasma sources; semiconductor device manufacture; plasma materials processing; plasma temperature; sputter etching; electron density; plasma density; coils; plasma simulation
Subjects: Fluid mechanics and aerodynamics (mechanical engineering); Surface treatment and coating techniques; Semiconductor industry; Plasma applications in manufacturing and materials processing; Industrial processes
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