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Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

Hardware design and key submodule testing of the world's first single-level press-pack IGBT based modular multilevel converter for VSC HVDC

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8th IET International Conference on Power Electronics, Machines and Drives (PEMD 2016) — Recommend this title to your library

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Inspec keywords: power semiconductor switches; HVDC power convertors; insulated gate bipolar transistors; bridge circuits; semiconductor device packaging; power bipolar transistors

Subjects: DC-AC power convertors (invertors); d.c. transmission; Power electronics, supply and supervisory circuits; Power semiconductor devices; Insulated gate field effect transistors; Product packaging; Bipolar transistors; AC-DC power convertors (rectifiers)

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content/conferences/10.1049/cp.2016.0225
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