Nanoscale particles modified gold plating for electrical contacts
Nanoscale particles modified gold plating for electrical contacts
- Author(s): Song Jian ; C. Koch ; Wang Liangliang
- DOI: 10.1049/cp.2012.0671
For access to this article, please select a purchase option:
Buy conference paper PDF
Buy Knowledge Pack
IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.
26th International Conference on Electrical Contacts (ICEC 2012) — Recommend this title to your library
Thank you
Your recommendation has been sent to your librarian.
- Author(s): Song Jian ; C. Koch ; Wang Liangliang Source: 26th International Conference on Electrical Contacts (ICEC 2012), 2012 p. 331 – 337
- Conference: 26th International Conference on Electrical Contacts (ICEC 2012)
- DOI: 10.1049/cp.2012.0671
- ISBN: 978-1-84919-508-9
- Location: Beijing, China
- Conference date: 14-17 May 2012
- Format: PDF
When using precious metals, one of the limitations to their lifetime is the tribological behaviour of the plating material, particularly the wear resistance. Gold is one of the most commonly used precious plating materials for high performance connectors. Pure gold is very soft. In order to improve the wear resistance of gold plates, hard gold is usually used. The high degree of hardness is achieved by alloying elements such as cobalt, iron or nickel. However, the effect of alloying elements is limited by the galvanic process and other surface properties, which are also required for electric contacts. Our study investigates a new way of modification of gold plates. Instead of alloying elements, nanoscale particles both metal oxides and PTFE particles, are used for the modification of plates. Some of the nanoscale particles show considerable impact on the performance of plates for electric contacts. This paper shows the new results and new challenges when using nanoscale particles for electroplating.
Inspec keywords: nanoparticles; electroplating; nanofabrication; gold; nanocontacts; hardness; electric connectors; wear resistance
Subjects: Deposition from liquid phases (melts and solutions); Methods of nanofabrication and processing; Nanometre-scale semiconductor fabrication technology; Friction, lubrication, and wear; Fatigue, embrittlement, and fracture; Deposition from liquid phases; Connectors
Related content
content/conferences/10.1049/cp.2012.0671
pub_keyword,iet_inspecKeyword,pub_concept
6
6