Microwave Field-Effect Transistors: Theory, design and applications (3rd Edition)
This book covers the use of devices in microwave circuits and includes such topics as semiconductor theory and transistor performance, CAD considerations, intermodulation, noise figure, signal handling, S-parameter mapping, narrow- and broadband techniques, packaging and thermal considerations. Perhaps the most comprehensive text on GaAs FET technology and its practical application. It covers the use of MESFET devices in microwave circuits, such as low-noise amplifiers, mixers, oscillators, power amplifiers, switches and multipliers. This text is a classic reference for all engineers involved in the development of solid state microwave devices.
Inspec keywords: integrated circuit packaging; oscillators; amplifiers; gallium arsenide; III-V semiconductors; microwave field effect transistors; semiconductor device packaging; mixers (circuits)
Other keywords: FET oscillators; FET theory; FET packaging; IC packaging; III-V materials; microwave field-effect transistors; gallium arsenide integrated circuits; transistor amplifiers; GaAs; FET circuits; FET mixers
Subjects: Modulators, demodulators, discriminators and mixers; Insulated gate field effect transistors; Solid-state microwave circuits and devices; Amplifiers; Oscillators; Other field effect devices; Product packaging; General electrical engineering topics
- Book DOI: 10.1049/SBEW016E
- Chapter DOI: 10.1049/SBEW016E
- ISBN: 9781884932502
- e-ISBN: 9781613530795
- Page count: 703
- Format: PDF
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Front Matter
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1 Introduction
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A monograph on microwave field effect transistors would be incomplete without an introductory chapter on basic semiconductor theory. Thus, this chapter gives a basic review of energy bands in solids and introduces the reader to the concepts of intrinsic and impurity semiconductors and metal-to-semiconductor contacts.
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2 GaAs FET Theory-Small Signal
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This chapter givens an introduction to the theory of small signal GaAs MESFETs with particular emphasis on the models used to predict the FET gain and noise figure performance. Such calculations have led to better FET structures and geometries being introduced as a means to exploit the intrinsically superior properties of GaAs over Si. The properties of the dual-gate FET have also been covered in some depth as this particular type of device has proved itself to be especially useful in microwave circuit applications.
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3 GaAs FET Theory-Power
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This chapter will review the operating principles of the power GaAs FET and discuss the various structures that are being used to increase device performance. The large signal performance of the device will be analyzed together with its third order intermodulation distortion and gain compression characteristics.
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4 Requirements and Fabrication of GaAs FETs
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This chapter has attempted to give a review of material preparation techniques and FET fabrication processes related specifically to GaAs.With the advent of ion implantation and more complicated device structures 'wet' etching techniques are giving way to 'dry' methods such as ion beam milling to define gate metallization and plasma etching for dielectric definition. Also, considerable effort has been applied to improving the reliability of both low-noise and power FETs by careful choice of metallizations and device design.
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5 The Design of Transistor Amplifiers
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This chapter has dealt with the extensive subject of microwave amplifier design with particular reference to the use of gallium arsenide field effect transistors. The descriptions given are by no means complete and the reader is referred to the references as a means to further study.
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6 FET Mixers
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This chapter has dealt with the subject of single and dual gate FETs used in frequency conversion applications. It has been shown (Loriou et al, 1976) that both types of MESFET suffer from 1/f noise contributions for IFs much below a few hundred megahertz. The general device requirements for FETs to be used in mixer and other conversion circuits are very similar to those requirements for low noise amplifiers. Recently, considerable theoretical work has been achieved to explain observed FET mixer noise figure performances with the frequency of the IF and the signal LO and IF loads. Recent studies into the signal, LO, IF, image and sum frequency terminations have given an insight into the optimum conditions for conversion gain especially with single gate FET mixers. Since the matching of the second gate of a dual gate FET can be difficult over relatively broad bandwidths, as it is in the amplifier case discussed in Chapter 2, the use of dual-gate FETs in mixers, although producing simple injection of LO and signal frequencies, has led to other FET based circuits being realized particularly at the lower frequencies (Van Tuyl, 1980; Suffolk et al, 1980; Ablassmeier, et al, 1980). Dual-gate FETs are now receiving considerable attention as efficient up-converters and multipliers as well as in self-oscillating mixer circuits (Stahlmann et al, 1979).
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7 GaAs FET Oscillators
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In this chapter the design and application of the GaAs FET as microwave oscillators has been covered. It was seen that the introduction of external elements is usually necessary to induce negative resistance conditions. Apart from the relatively poor close to carrier noise performance of free running GaAs FET oscillators, their other features appear quite attractive. The compatibility of FET oscillator circuits and ceramic resonators have resulted in improved performance of stabilized sources. Electronic tuning capabilities of GaAs FET oscillators using varactor diodes and VIG resonators are impressive and will form important building blocks for microwave systems.
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8 FET and IC Packaging
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Small signal GaAs FETs are, at present, available in hermetic packages up to 20 GHz or so with power FET packages containing some internal matching being available up to 18 GHz. Advances in packaging techniques are being seen in all areas perhaps most noticeably in the area of low-cost sub-systems using analogue and digital ICs. Such packaged devices offer considerable advantages to the user. The components can be pretested and screened to the quality levels demanded by commercial, military and space applications much more easily than bare-chip devices. The user is provided with a much easier to handle component especially if die handling and wire bonding facilities are not available.
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9 Novel FET Circuits
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This chapter is intended as an introduction to the use of GaAs FETS in circuit roles other than the usual ones of amplification, oscillation and frequency conversion. Both single and dual gate FETS, whether they be low noise or power devices have been used successfully in a variety of microwave applications such as switches, attenuators, phase shifters and modulators. The introduction of monolithic circuits, dealt with in more detail in Chapter 10, has enabled many of these circuits to be fabricated on single chips of GaAs. However, many of the circuits have also been implemented using bare chip FETS and hybrid microstrip techniques (Pengelly et al, 1980).
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10 Gallium Arsenide Integrated Circuits
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It has been seen in this chapter that the GaAs field effect transistor is playing an important role in the development of integrated circuits. Analogue microwave circuits fabricated on gallium arsenide have a performance which is unattainable using silicon. Digital logic circuits on GaAs have a five times speed advantage over silicon at the present time but the massive investment in the very high speed IC (VHSIC) program in the USA will undoubtedly narrow the gap. However, there are many promising logic architectures based on GaAs MESFETs, JFETs and MOSFETs which will progress rapidly as the technology matures. The bibliography below is intended as a guide to further reading and papers not referred to in the text are also included. The complexity of both analogue and digital GaAs Ics is increasing rapidly. Markets for GaAs Ics are becoming well defined and a $1500 million market in the USA alone is anticipated by 1990, which assuming modest requirements in the early 1980's infers a growth in the market in excess of 100% per annum over the next decade.
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11 Other III-V Materials and Devices
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This chapter presents a brief introduction to field effect transistor structures, such as HEMT and MESFET, using either materials other than GaAs or different operating principles to improve the performance of or extend the useful frequency range of these three terminal solid state devices.
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Back Matter
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