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Electrical bonding refers to the process by which parts of an assembly, equipments, or subsystems are joined together in a manner such that they provide low contact impedance. The objective is to make the joined structures homogenous with respect to the flow of RF currents. This mitigates electrical potential differences that can produce EMI among metallic parts.

Chapter Contents:

  • 7.1 Effects of Poor Bonds
  • 7.2 Bond Equivalent Circuits, Resistance, and Impedance
  • 7.3 Direct Bonds
  • 7.3.1 Screws and Bolts
  • 7.3.2 Soft Solder
  • 7.3.3 Brazing
  • 7.3.4 Welding
  • 7.3.5 Cadweld Joints
  • 7.3.6 Conductive Adhesive, Caulking, and Grease
  • 7.3.7 Bonding of Composite Materials and Conductive Plastics
  • 7.4 Indirect Bonds
  • 7.4.1 Jumpers and Bond Straps
  • 7.5 Corrosion and Its Control
  • 7.5.1 Galvanic Corrosion
  • 7.5.2 Electrolytic Corrosion
  • 7.5.3 Finishes
  • 7.5.4 Corrosion Protection
  • 7.6 Equipment Bonding Practices
  • 7.7 Summary of Bonding Principles
  • Suggested Readings: Bonding

Inspec keywords: electromagnetic interference; bonding processes

Other keywords: electrical bonding; RF currents; low contact impedance; subsystems; equipments; metallic parts; assembly; EMI

Subjects: General fabrication techniques; Electromagnetic compatibility and interference

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