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FET and IC Packaging

FET and IC Packaging

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Small signal GaAs FETs are, at present, available in hermetic packages up to 20 GHz or so with power FET packages containing some internal matching being available up to 18 GHz. Advances in packaging techniques are being seen in all areas perhaps most noticeably in the area of low-cost sub-systems using analogue and digital ICs. Such packaged devices offer considerable advantages to the user. The components can be pretested and screened to the quality levels demanded by commercial, military and space applications much more easily than bare-chip devices. The user is provided with a much easier to handle component especially if die handling and wire bonding facilities are not available.

Chapter Contents:

  • 8.1 Introduction
  • 8.2 Packages and Sealing
  • 8.3 Package Modeling
  • 8.4 Prematched GaAs FETs
  • 8.5 Packaging and Thermal Resistance
  • 8.6 GaAs IC Packaging
  • 8.7 Conclusions
  • 8.8 Bibliography

Inspec keywords: field effect transistors; integrated circuit packaging

Other keywords: small signal GaAs FET; IC packaging; power FET

Subjects: Product packaging; Other field effect devices; Insulated gate field effect transistors

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