How Chips Are Made
How Chips Are Made
- Author(s): Charles Hawkins ; Jaume Segura ; Payman Zarkesh-Ha
- DOI: 10.1049/SBCS501E_ch12
For access to this article, please select a purchase option:
Buy chapter PDF
Buy Knowledge Pack
IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.
Thank you
Your recommendation has been sent to your librarian.
Chapter Contents:
Inspec keywords: CMOS integrated circuits; integrated circuit packaging; dielectric materials; semiconductor doping; sawing; integrated circuit design; integrated circuit reliability; photolithography; integrated circuit testing; quality control; silicon compounds; integrated circuit manufacture; vias
Other keywords:
Subjects: Product packaging; Lithography (semiconductor technology); Dielectric materials and properties; Metallisation and interconnection technology; CMOS integrated circuits; Semiconductor integrated circuit design, layout, modelling and testing; Semiconductor doping
- Book DOI: 10.1049/SBCS501E
- Chapter DOI: 10.1049/SBCS501E_ch12
- ISBN: 9781613530023
- e-ISBN: 9781613530269
How Chips Are Made, Page 1 of 2
< Previous page | Next page > /docserver/preview/fulltext/books/cs/sbcs501e/SBCS501E_ch12-1.gif /docserver/preview/fulltext/books/cs/sbcs501e/SBCS501E_ch12-2.gif