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Runtime thermal management of many-core systems

Runtime thermal management of many-core systems

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Chapter Contents:

  • 9.1 Thermal management of many-core embedded systems
  • 9.1.1 Uncertainty in workload estimation
  • 9.1.2 Learning-based uncertainty characterization
  • Multinomial logistic regression model
  • Maximum likelihood estimation
  • Uncertainty interpretation
  • 9.1.3 Overall design flow
  • 9.1.4 Early evaluation of the approach
  • Impact of workload uncertainty: H. 264 case study
  • Thermal improvement considering workload uncertainty
  • 9.2 Thermal management of 3D many-core systems
  • 9.2.1 Recent advances on 3D thermal management
  • 9.2.2 Preliminaries
  • Application model
  • Multiprocessor platform model
  • 3D IC model
  • 9.2.3 Thermal-aware mapping
  • Thermal profiling
  • Runtime
  • Application merging
  • Resource allocation
  • Throughput computation
  • Utilization minimization
  • 9.2.4 Experimental results
  • Benchmark applications
  • Target 3D many-core system
  • Temperature simulation
  • Interconnect energy computation
  • Thermal profiling results
  • Benchmark application results
  • Case-study for real-life applications
  • 9.3 Conclusions and future directions
  • References

Inspec keywords: thermal management (packaging); multiprocessing systems; parallel processing

Other keywords: submicron technology nodes; high-performance computing; leakage power; many-core systems; system-on-chip; thermal management

Subjects: Product packaging; Multiprocessing systems

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