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Thin-film deposition: physical techniques

Thin-film deposition: physical techniques

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The quality and the characteristics of the fabricated films are governed in PVD by numerous parameters, such as the deposition rate, substrate temperature, sub-strate materials and deposition atmosphere. In this chapter, we will first give a quick hint on the main PVD techniques and, then, a more detailed vision of the sputtering process without losing the generality of the presentation.

Chapter Contents:

  • 7.1 Introduction
  • 7.2 Thermal processes
  • 7.2.1 Vacuum evaporation
  • 7.2.2 Pulsed laser deposition
  • 7.2.3 Molecular beam epitaxy
  • 7.3 Sputtering
  • 7.3.1 DC sputtering
  • 7.3.1.1 Cathode and anode sheaths
  • 7.3.1.2 DC discharge model
  • 7.3.2 RF sputtering
  • 7.3.2.1 RF discharge model
  • 7.3.2.2 Matching network
  • 7.3.2.3 Magnetron
  • 7.3.2.4 Control system of the thickness
  • 7.4 Conclusions
  • Acknowledgements
  • References

Inspec keywords: substrates; thin films; sputter deposition; vacuum deposition

Other keywords: atmospheric deposition; sputtering process; substrate temperature; thin-film deposition; PVD techniques

Subjects: Deposition by sputtering; Vacuum deposition; Thin film growth, structure, and epitaxy

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