The device fabrication process for low-frequency MEMS resonator is explained in this chapter. Challenges faced during the fabrication process and experiments performed to solve those issues are also discussed. All the processes such as metal deposition, dielectric deposition, electroplating, and wet etching must be studied by performing experiments to determine its deposition and etching rate, respectively. The rate of deposition in electroplating at room temperature is very less; it can be increased by increasing the current density and temperature of the electroplating solution. Observations and measurements of dimensions and thickness need to be regularly performed after every fabrication step. It helps to confirm the correctness of the process. Physical characterization and electrical characterization need to be performed on the fabricated device to validate the proposed concept.

Chapter Contents:

• 6.1 Introduction
• 6.2 Fabrication processes
• 6.2.1 Wafer cleaning process
• 6.2.2 Oxide deposition
• 6.2.3 Thin-film deposition
• 6.2.3.1 Physical vapor deposition
• 6.2.3.2 Sputter deposition
• 6.2.3.3 Chemical vapor deposition
• 6.2.3.4 Electrodeposition
• 6.2.3.5 Spin coating
• 6.2.3.6 Photolithography
• 6.2.3.7 Etching
• 6.2.3.8 Liftoff
• 6.3 Device fabrication
• 6.4 Challenges in fabrication
• 6.5 Summary
• References

Inspec keywords: electroplating; microfabrication; micromechanical resonators; etching

Other keywords: electroplating; physical characterization; electrical characterization; low-frequency MEMS resonator; wet etching; dielectric deposition; current density; metal deposition

Subjects: Fabrication of MEMS and NEMS devices; Deposition from liquid phases