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Introduction

Introduction

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In the literature, SAW BAW, FBAR, and CMR are treated as the same class of devices and often treated as micromachined electromechanical devices. BAW and FBAR are differentiated by its mounting technologies. In the literature, some other classes of devices, such as capacitive micromachined ultrasonic transducers (CMUTs), are also sometimes called BAW devices. In general, the devices are called MEMS if they are fabricated by using thin and thick film processes used in integrated circuits (IC) fabrication or popularly known as CMOS process. Today, SAW, SMR, FBAR, and CMR devices can be fabricated within standard IC technologies. Additionally, FBAR manufacturing entails micromachining steps, like MEMS resonator processes. On the other hand, FBARs resonate at far-from-fundamental acoustic modes, instead of purely mechanical modes. Both circumstances have thus created certain controversy regarding whether FBARs are considered as MEMS resonators. However, in this book, any microstructure used for filter applications are referred to as MEMS resonators. The distinct feature of all these components is high Q, indicating that less energy dissipated, helps in low power designs.

Chapter Contents:

  • 1.1 Low power issues
  • 1.2 Miniaturization
  • 1.3 Tunable filters
  • 1.4 Integration with CMOS
  • 1.5 Inside the book
  • References

Inspec keywords: thin film circuits; micromechanical resonators; integrated circuit technology; integrated circuit design; CMOS integrated circuits; surface acoustic wave resonator filters; integrated circuit manufacture; bulk acoustic wave devices; ultrasonic transducers; capacitive transducers; low-power electronics; thick film circuits

Other keywords: bulk acoustic wave; contour-mode resonator; CMR devices; SAW devices; integrated circuits; microelectromechanical systems; FBAR devices; CMOS process; IC fabrication; BAW devices; CMUT; micromachined electromechanical devices; thin film processes; low power designs; MEMS resonator filters; surface acoustic wave; complementary metal-oxide-semiconductor; capacitive micromachined ultrasonic transducers; thin-film bulk acoustic wave resonator; thick film processes

Subjects: Semiconductor integrated circuit design, layout, modelling and testing; General electrical engineering topics; Passive filters and other passive networks; Electrical/electronic equipment (energy utilisation); Integrated circuits; Microsensors and nanosensors; Transducers; Sonic and ultrasonic transducers; Transduction; devices for the generation and reproduction of sound; Textbooks; CMOS integrated circuits; MEMS and NEMS device technology; Production facilities and engineering; Acoustic wave devices; Micromechanical and nanomechanical devices and systems

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