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## Asynchronous circuits for extreme temperatures

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This chapter presented successful physical testing results of multiple NCL circuit designs of varying size and complexity across a very large temperature range. For high-temperature applications, a SiC process developed by Raytheon was leveraged and exhibited circuits functioning at temperatures exceeding 500 °C. For low temperature applications, the industry standard IBM 0.5 μm SiGe process was leveraged and exhibited circuits functioning as temperatures approached absolute zero. Through all these tests, the NCL circuits required no special considerations (due to environmental effects on the device level) to maintain correct operation across these wide temperature swings. In the same conditions, synchronous systems would require significant effort (either through complex logical design changes or physical setup considerations) in order to meet their timing constraints which always leads to a large amount of overhead incurred. These results have proven the flexibility and robustness advantage that asynchronous systems have over synchronous designs.

Chapter Contents:

• 10.1 Digital circuitry in extreme environments
• 10.2 Asynchronous circuits in high-temperature environments
• 10.2.1 High temperature NCL circuit project overview
• 10.2.2 High temperature NCL circuit results
• 10.3 Low temperature NCL circuit project overview
• 10.3.1 Low temperature NCL circuit project overview
• 10.3.2 Low temperature NCL circuit results
• 10.4 Conclusion
• References

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