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Future prospects

Future prospects

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Design of Terahertz CMOS Integrated Circuits for High-Speed Wireless Communication — Recommend this title to your library

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We have discussed circuit technologies and examples of architectures that are needed to realize complementary metal oxide semiconductor (CMOS) transceivers in the terahertz band. At the time of writing this book, there are still several issues to be solved until the terahertz CMOS circuit matures to technology that anyone can use. In the circuit, issues to be addressed such as a low-noise signal source and a highspeed baseband circuit remain. It is necessary to take time to study these issues in the future. However, on the other hand, the discussion on what kind of future the terahertz communication system opens will be helpful in considering what kind of technology should be developed. In the last chapter, we would like to discuss how to use frequencies in the 300 GHz band, and what kind of applications will be expanded in future if technology matures.

Chapter Contents:

  • 5.1 Channel allocation planning for 300-GHz band [8]
  • 5.2 The future of terahertz communication spreading in space [5]
  • 5.3 Summary
  • 5.4 Concluding remarks
  • References

Inspec keywords: submillimetre wave receivers; terahertz wave devices; CMOS integrated circuits; radio transceivers; submillimetre wave integrated circuits; high-speed integrated circuits; technological forecasting

Other keywords: terahertz band; high-speed baseband circuit; terahertz CMOS circuit; low-noise signal source; frequency 300 GHz; CMOS transceivers; complementary metal oxide semiconductor; terahertz communication system; future prospects; circuit technologies

Subjects: Radio links and equipment; Microwave integrated circuits; CMOS integrated circuits

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