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Component-and module-level measurements

Component-and module-level measurements

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Regardless of the different transceiver architectures that an RFIC module can have, this Chapter aims to outline common measures and test setups used in the characterization of RF modules, large and small signal measurements. Different characterization techniques are available to test the individual performance of passive and active components in an RF module as well as the performance of the full RF chain. RF and microwave measurements can be classified under several categories: time and frequency domain, small and large signal, discrete component and system level, receiver and transmitter-related measurements, etc.

Chapter Contents:

  • 8.1 Introduction
  • 8.2 Small-signal measurements
  • 8.3 Large-signal measurements
  • 8.3.1 Transmitter-related measurements
  • 8.3.1.1 Harmonics
  • 8.3.1.2 Intermodulation distortion
  • 8.3.1.3 Third-order intercept point
  • 8.3.1.4 Gain compression point
  • 8.3.1.5 Transmitter leakage and spurious emissions
  • 8.3.1.6 Envelope and average power tracking
  • 8.3.1.7 Error vector magnitude
  • 8.3.1.8 Adjacent channel leakage ratio
  • 8.3.2 Receiver-related measurements
  • 8.3.2.1 Noise figure
  • 8.3.2.2 Receiver sensitivity
  • 8.3.2.3 Desense
  • 8.3.2.4 Dynamic range
  • 8.4 Radiated immunity and emission measurement
  • 8.5 Wafer-level RF measurement
  • 8.6 Phase stability in RF test cables
  • 8.7 Port reduction method
  • References

Inspec keywords: transceivers; integrated circuit measurement; microwave measurement; radiofrequency integrated circuits; radiofrequency measurement

Other keywords: module-level measurements; phase stability; small-signal measurements; component-level measurements; RF test cables; wafer-level RF measurement; port reduction method; large-signal measurements; radiated immunity; emission measurement

Subjects: Microwave measurement techniques; Semiconductor integrated circuits; Radio links and equipment; Microwave integrated circuits

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