Almalkawi, Mohammad: 'RF and microwave device and module packaging' (Materials, Circuits and Devices, 2019), 'RF and Microwave Module Level Design and Integration', Chap. 1, pp. 1-28, DOI: 10.1049/PBCS034E_ch1 IET Digital Library, https://digital-library.theiet.org/;jsessionid=46e75btqep93s.x-iet-live-01content/books/10.1049/pbcs034e_ch1