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RF and microwave device and module packaging

RF and microwave device and module packaging

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The Chapter begins with a discussion of commonly used packaging technologies in the semiconductor industry and highlights their trade-offs when it comes to choosing the suitable packaging solution for a particular application. It goes on to discuss microelectronics fabrication, and then RF and microwave module types.

Chapter Contents:

  • 1.1 Introduction
  • 1.2 Packaging technologies
  • 1.2.1 System on chip
  • 1.2.2 System on package
  • 1.2.3 System in package
  • 1.2.4 Wafer level packaging
  • WLP flip-chip technology
  • WLP chip scale packaging
  • 1.2.5 Other packaging technologies
  • 1.3 Microelectronics fabrication
  • 1.3.1 Photolithography fabrication
  • 1.3.2 Substrate technologies
  • Silicon on sapphire
  • Silicon on insulator
  • 1.3.3 Microelectronics metallization and characterization
  • Skin depth
  • Thin film stress
  • Thin film thickness measurement methods
  • Characterization of sheet and bulk resistance
  • Electromigration
  • Electroless and electrolytic plating
  • Metal selection and design considerations
  • 1.3.4 Dielectric permittivity characterization
  • 1.3.5 Cleanroom classifications
  • 1.4 RF and microwave module types
  • 1.4.1 Monolithic modules
  • 1.4.2 Hybrid modules
  • Thick-film ICs
  • Thin-film ICs
  • 1.4.3 Multichip modules
  • References

Inspec keywords: electronics packaging; modules; microwave integrated circuits; radiofrequency integrated circuits

Other keywords: device packaging; multichip modules; microelectronics characterization; system in package; microwave devices; microelectronics metallization; module packaging; substrate technologies; system on package; dielectric permittivity; photolithography fabrication; microwave module; system on chip; RF module; cleanroom classifications; hybrid modules; RF devices; wafer level packaging; monolithic modules

Subjects: Microwave integrated circuits; Semiconductor integrated circuits; Product packaging

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