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Green on-chip inductors for three-dimensional integrated circuits: concepts, algorithms and applications

Green on-chip inductors for three-dimensional integrated circuits: concepts, algorithms and applications

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Nano-CMOS and Post-CMOS Electronics: Circuits and Design — Recommend this title to your library

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This chapter deals with a completely different aspect of circuit and design as compared to the previous chapters. This chapter discusses three-dimensional integrated circuits (3D ICs) as compared to the planner integrated circuits of the previous chapters. The 3D ICs have shown significant promise for the future post-CMOS era circuits and systems to build high-performance systems with minimal silicon foot print. This chapter specifically discusses practical approaches to through-silicon-via (TSV) inductors which constitute the vertical signal, power and thermal paths which is very critical for 3D ICs.

Chapter Contents:

  • 10.1 Introduction
  • 10.2 Effect of various parameters of an on-chip inductor
  • 10.2.1. Impact of process parameters
  • 10.2.1.1 Substrate height (H)
  • 10.2.1.2 Substrate conductivity (σ)
  • 10.2.1.3 TSV diameter (D)
  • 10.2.1.4 Liner thickness (d)
  • 10.2.1.5 Metal height (h)
  • 10.2.2. Design parameters
  • 10.2.2.1 Number of turns (N)
  • 10.2.2.2 Number of tiers (T)
  • 10.2.2.3 Loop pitch (P)
  • 10.2.2.4 Metal width (W)
  • 10.3 Low-frequency applications
  • 10.3.1. DC-DC converter design
  • 10.3.1.1 Overview of inductive DC-DC converters
  • 10.3.1.2 TSV inductor design
  • 10.3.1.3 Experimental results
  • 10.3.2. Resonant clocking implementation
  • 10.3.2.1 Overview of LC resonant clocking
  • 10.3.2.2 Inductor placement
  • 10.3.2.3 Experimental results
  • 10.4 Micro-channel shielding
  • 10.5 Summary and conclusions
  • References

Inspec keywords: three-dimensional integrated circuits; inductors; CMOS integrated circuits

Other keywords: 3D ICs; through-silicon-via; TSV inductors; green on-chip inductors; three-dimensional integrated circuits; thermal paths; future post-CMOS era circuits; high-performance systems; minimal silicon foot print

Subjects: CMOS integrated circuits; Inductors and transformers

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