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LET is a technique for defectoscopy. Defectoscopy techniques themselves are not meant to provide absolute values describing the specimen's state but indicating the risk of the presence of a defect. Therefore, the specimen is tested by a system of sensors under certain, quasi constant conditions.This book chapter describes how LET can be applied for nondestructive material parameter evaluation.

Chapter Contents:

  • 6.1 Sigmometry
  • 6.1.1 Introduction and motivation
  • 6.1.2 Basic principle
  • 6.1.3 Semianalytical and numerical calibration
  • 6.1.4 Experimental validation
  • Methodology characterization
  • Conductivity measurement
  • 6.1.5 Findings
  • 6.2 Defectocscopy of multilayered structures
  • 6.2.1 LET measurements of alucobond specimen
  • 6.2.2 Forward simulations
  • 6.2.3 Defect identification
  • Inverse solution strategy
  • 6.2.4 Results and discussion
  • 6.3 Inspection of composites
  • 6.3.1 Composite material
  • 6.3.2 Glass laminate aluminum reinforced epoxy (GLARE)
  • Magnetic field measurement
  • Force measurements
  • Defect localization
  • 6.3.3 Carbon fiber reinforced polymer (CFRP)
  • Introduction to FRP
  • CFRP test specimens
  • Conductivity measurement
  • Measurements with CFRP samples
  • Numerical modeling of CFRP
  • LET experiments with CFRP
  • Summary
  • 6.4 Defectoscopy of friction stir welding
  • 6.4.1 Friction stir welding (FSW)
  • Imperfections/defects caused by FSW
  • Typical weld seam defects
  • 6.4.2 FSW experiments
  • 6.4.3 NDT of friction stir welds
  • 6.4.4 MIECT measurements of friction stir welds
  • 6.4.5 Potential applications of MIECT
  • Nondestructive defect detection of FSW
  • Material science
  • Process control and monitoring
  • 6.5 Application to ferromagnetic materials

Inspec keywords: flaw detection; eddy current testing; inductive sensors

Other keywords: sensors; defect presence risk; nondestructive material parameter evaluation; quasi constant conditions; LET defectoscopy

Subjects: Nondestructive testing: eddy current testing and related techniques; Magnetic instruments and techniques; Sensing devices and transducers; Sensing and detecting devices; Electrical instruments and techniques; Materials testing

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