Inspec keywords: etching; capacitive sensors; accelerometers; suspensions (mechanical components); silicon-on-insulator; microsensors

Other keywords: structure flexibility; sensing capacitance; dry etching process; anisotropic wet etching; sensing mode; capacitance accelerometer; low cross axis sensitivity microgravity microelectromechanical system; L-shaped beams mirror; though wafer thickness; symmetric microelectromechanical system; flexible mechanical suspension; double device layer silicon-on-insulator; vibration mode

Subjects: Design and modelling of MEMS and NEMS devices; Sensing and detecting devices; Velocity, acceleration and rotation measurement; Velocity, acceleration and rotation measurement; Microsensors and nanosensors; Micromechanical and nanomechanical devices and systems; Fabrication of MEMS and NEMS devices