Inspec keywords: silicon compounds; thermal stability; semiconductor device packaging; ion implantation; power semiconductor devices; semiconductor materials

Other keywords: contacting systems; thermal stability; power devices; power densities; thermal cycling stresses; dynamic performance; SiC-SiO2; wafer quality; packaging techniques; die temperature; ion implantation; power semiconductor devices; device processing technology

Subjects: Product packaging; Power semiconductor devices; Semiconductor doping; Packaging