Inspec keywords: multiprocessing systems; system-on-chip; power consumption; power aware computing; cooling; microprocessor chips; software agents

Other keywords: performance requirements; operating temperature; power consumption; lifetime reliability; thermal cycling; intelligent software agent; heterogeneous multiprocessor systems-on-chips; performance requirement; heterogeneous MPSoCs; HiSilicon Kirin 659 MPSoC; agent-based performance aware thermal management unit; dynamic voltage and frequency scaling capabilities; P-EdgeCoolingMode; spatial gradient; DVFS; thermal gradient; light-weight thermal management mechanism

Subjects: System-on-chip; Performance evaluation and testing; Multiprocessing systems; Expert systems and other AI software and techniques; Other aspects of analogue and digital computers; Microprocessor chips; Microprocessors and microcomputers; System-on-chip