Inspec keywords: electroplating; silicon; light emitting diodes; semiconductor device metallisation; electronics packaging; photoresistors; elemental semiconductors

Other keywords: negative photoresistors; electroplating method; reflector; high-power light-emitting diode module; LED module; electrical interconnections; electrode-guided interconnections; packaging platform

Subjects: Product packaging; Light emitting diodes; Photoelectric devices; Metallisation and interconnection technology