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Editorial team

Chief Advisors:

  • Lionel Tarassenko, University of Oxford
  • Naomi Climer, International Broadcasting Convention Council and Future Communications Challenge Group Chair, UK

Section Editors:

  • Biomedical Engineering: Jun Ohta, AIST-Nara, Japan
  • Civil Engineering: Rahim Benekohal, University of Illinois, USA
  • Computing and Software: Paul Krause, University of Surrey, UK
  • Energy Engineering: Kai Strunz, TU Berlin, Germany
  • Materials Engineering: Mike Fitzpatrick, Coventry University, UK
  • Micro- and Nanotechnology: Alice Zhang , Peking University, China
  • Mechanical Engineering: J. Paulo Davim, University of Aveiro, Portugal
  • Electrical and Electronic Engineering: Jan Van der Spiegel, University of Pennsylvania, USA

Deputy Section editors:

  • Professor Ghassan Abu-Lebdeh, American University of Sharjah, UAE
  • Professor Dr. Uday Shanker Dixit, Indian Institute of Technology Guwahati, India
  • Assistant Professor Angelos Markopoulos, National Technical University of Athens, Greece
  • Professor Toshiya Sakata, The University of Tokyo, Japan
  • Professor Lucio Soibelman, University of Southern California, USA

Associate Editors:

  • Taufik Abrão, State University of Londrina (UEL), Brazil
  • Rehan Ahmed, Herriott Watt University, UK
  • Amir H. Alavi, Michigan State University, USA
  • Hideyuki Arata, Higashiyama Live-Holonics Project, Nagoya University, Japan
  • Kwok Sum Chan, City University of Hong Kong, Hong Kong
  • Jung-Chih Chiao, University of Texas at Arlington, USA
  • Andrea Cristofaro, University of Camerino, Italy
  • Nashwan Dawood, Teeside University, UK
  • Loreto Di Donato, University of Catania, Italy
  • Christopher Donaghy-Spargo, Durham University, UK
  • Robert Edwards, University of Loughborough, UK
  • Robert Feldt, Blekinge Institute of Technology and Chalmers University of Technology, Sweden
  • Amir H. Gandomi, Michigan State University, USA
  • Paolo Gargiulo, Reykjavik University & Landspitali, Iceland
  • Ellen Heely, Open University, UK
  • Ivan Hofsajer, University of Witwatersrand, South Africa
  • Jason Ingham, University of Auckland, New Zealand
  • Mehmet Karaköse, Firat University, Turkey
  • Mandy Korff, Deltares, Netherlands
  • Rakhesh Singh Kshetrimayum, Indian Institute of Technology Guwahati, India
  • Andrea Francesco Morabito, University of Reggio Calabria, Italy
  • Paul W. Nutter, The University of Manchester, UK
  • Soh Khim Ong, National University of Singapore, Singapore
  • Ifiok Otung, University of South Wales, UK
  • Lung Kwang Pan, Central University of Science and Technology, Taiwan
  • Bala Pesala, Central Electronics Engineering Research Institute (CEERI), India
  • Ramesh Rayudu, Victoria University of Wellington, New Zealand
  • Jose Joaquin Rieta, Polytechnic University of Valencia, Spain
  • Renato Rizzo, Università degli Studi di Napoli Federico II, Italy
  • Loredana Santo, University of Rome 'Tor Vergata', Italy
  • Amir Sobhani, Monash University, Australia
  • Houbing Song, Embry-Riddle Aeronautical University, USA
  • Ling Sun, Technical University of Denmark, Denmark
  • Vladan Velisavljevic, University of Bedfordshire, UK
  • David Weston, Leicester University, UK
  • Yumin Ye, University of Wisconsin-Madison, USA
  • Angelos Markopoulos, National Technical University of Athens, Greece
  • Uday Dixit, Indian Institute of Technology Guwahati, India

In-house Editorial team:

  • Senior Scientific Editor: James Baldwin
  • Managing Editor: Jennifer Grace
  • Editorial Assistant: Tom Dodds
  • Contact: joe@theiet.org
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