IET Computers & Digital Techniques
Volume 11, Issue 5, September 2017
Volumes & issues:
Volume 11, Issue 5
September 2017
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- Author(s): Shahzad Asif ; Md Selim Hossain ; Yinan Kong
- Source: IET Computers & Digital Techniques, Volume 11, Issue 5, p. 165 –172
- DOI: 10.1049/iet-cdt.2016.0141
- Type: Article
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165
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Public-key cryptosystems such as elliptic curve cryptography (ECC) and Rivest–Shamir–Adleman (RSA) are widely used for data security in computing systems. ECC provides a high level of security with a much smaller key than RSA, which makes ECC a preferred choice in many applications. This study proposes a multi-key ECC based on the residue number system. The proposed architecture employees deep pipelining to allow the concurrent encryption of 21 keys. The proposed architectures are implemented on two different field programmable gate array (FPGA) platforms and results are compared with existing ECC architectures. The proposed implementation on Virtex-7 FPGA achieves a throughput of 1816 kbps at a clock frequency of 73 MHz.
- Author(s): Rym Chéour ; Mohamed Wassim Jmal ; Olfa Kanoun ; Mohamed Abid
- Source: IET Computers & Digital Techniques, Volume 11, Issue 5, p. 173 –182
- DOI: 10.1049/iet-cdt.2017.0003
- Type: Article
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173
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The sharp increase of the wireless sensor networks (WSNs) performance has increased their power requirements. However, with a limited battery lifetime it is more and more difficult to deploy many more sensors with today's solutions. Therefore, the authors need to implement autonomous WSNs without any human intervention or external power supply. To this end, this study proposes an effective strategy to ensure an energy consumption gain that takes into account time constraints through a power-aware model based on the dynamic voltage and frequency scaling and the dynamic power management that are appropriate to the WSNs and on a global Earliest Deadline First scheduler. To select the most suitable simulator to integrate and simulate the developed models, >25 of the existing WSN simulators are outlined and evaluated. On the basis of this comparative study analysis, the authors chose the simulation tool for real-time multiprocessor scheduling (STORM) to validate their work for its multiple advantages.
- Author(s): M. Mohamed Asan Basiri and S.k. Noor Mohammad
- Source: IET Computers & Digital Techniques, Volume 11, Issue 5, p. 183 –189
- DOI: 10.1049/iet-cdt.2017.0051
- Type: Article
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This study proposes an efficient very large scale integration (VLSI) architecture for quadruple throughput fixed point multiply accumulate circuit (MAC). The proposed n × n bits MAC is used to perform one n × n bits or two n × (n/2) bits or four (n/2) × (n/2) bits MAC operations in parallel. The objective of the proposed MAC is to improve throughput of the existing MAC designs. The proposed and existing designs are implemented by 45 nm CMOS TSMC library and the results show that the proposed architecture achieves better improvement in throughput than existing designs. For example, the proposed 32 × 32 bits MAC architecture achieves 60.4% of improvement in throughput over existing array multiplier-based double throughput MAC.
- Author(s): Liang-Ying Lu and Lih-Yih Chiou
- Source: IET Computers & Digital Techniques, Volume 11, Issue 5, p. 190 –196
- DOI: 10.1049/iet-cdt.2016.0149
- Type: Article
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Nowadays, thermal simulators of integrated circuits (ICs) at architectural level tend to neglect thermal effects in temperature-dependent factors (such as leakage power and thermal conductivity) and a heat dissipation mechanism for thermal radiation at the early stages of IC design. Hence, the analysis results of thermal simulators may be not sufficient to reflect the physical–thermal interactive effects of ICs. This study presents a temperature gradient-aware thermal simulator for three-dimensional ICs (called 3D-TarGA) at the architectural level. The temperature gradient-aware thermal analysis of 3D-TarGA considers the thermal effects in leakage power, thermal conductivity, thermal radiation, and thermal convection to reflect the physical–thermal interactive effects of ICs at the early stages of IC design. Experimental results show that the maximum absolute error for the temperature of IC with ignoring the thermal effects using 3D-TarGA is 1.62°C, in contrast to the published thermal simulator, HotSpot. Moreover, the maximum absolute difference for the temperature of IC by considering the thermal effects is 2.7°C, as compared with that when ignoring the thermal effects for 3D-TarGA.
- Author(s): Shaista Jabeen ; Sudarshan Srinivasan ; Sana Shuja
- Source: IET Computers & Digital Techniques, Volume 11, Issue 5, p. 197 –203
- DOI: 10.1049/iet-cdt.2016.0189
- Type: Article
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A formal verification methodology for checking both functional and timing requirements of real-time digital controllers targeted at field programmable gate array technology is proposed. Timed transition systems (TTSs) are used to model both the digital controller circuit and the high-level specification requirements. Timed well-founded simulation (TWFS) refinement is used as the notion of correctness and defines what it means for an implementation TTS to satisfy a specification TTS. The primary contribution is a set of proof obligation templates (based on TWFS refinement) that account for both functional and timing requirements. The proof obligations generated using the templates can be checked using a decision procedure. One of the key ideas is the overloaded use of rank functions (that are typically used for liveness verification) for timing verification. The efficiency and scalability of the approach is demonstrated using three case studies.
High-throughput multi-key elliptic curve cryptosystem based on residue number system
Evaluation of simulator tools and power-aware scheduling model for wireless sensor networks
Quadruple throughput fixed point quarter precision multiply accumulate circuit design
Temperature gradient-aware thermal simulator for three-dimensional integrated circuits
Formal verification methodology for real-time Field Programmable Gate Array
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