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In this study, substrates with a large topography were aligned and bonded, and a spray-coated SU-8 was employed as the adhesive layer between two complementary non-planar surfaces. Both wafer-level and chip-level bonding were carried out with an alignment tolerance of 5 µm. The bonding pairs exhibited enhanced tensile strength and shearing strength compared to that of the planar surface bonding, which was influenced by the gap between the bonding surfaces. This technology meets the requirements of the wafer-level three-dimensional structure transfer and opens up possibilities for manufacturing more complicated microelectromechanical systems devices.
Inspec keywords: shear strength; tensile strength; photoresists; organic compounds; surface topography; adhesive bonding; spray coating techniques; wafer bonding
Other keywords:
Subjects: Spray coating techniques; Deformation and plasticity; Mechanical and acoustical properties of solid surfaces and interfaces; Solid surface structure; Deformation, plasticity and creep