Polarisation analysing complementary metal-oxide semiconductor image sensor in 65-nm standard CMOS technology
- Author(s): N. Wakama 1 ; D. Okabayashi 1 ; T. Noda 1 ; K. Sasagawa 1 ; T. Tokuda 1 ; K. Kakiuchi 1 ; J. Ohta 1
-
-
View affiliations
-
Affiliations:
1:
Graduate School of Materials Science , Nara Institute of Science and Technology (NAIST) , 8916-5 Takayama , Ikoma , Nara 630-0192 , Japan
-
Affiliations:
1:
Graduate School of Materials Science , Nara Institute of Science and Technology (NAIST) , 8916-5 Takayama , Ikoma , Nara 630-0192 , Japan
- Source:
Volume 2013, Issue 9,
September
2013,
p.
45 – 47
DOI: 10.1049/joe.2013.0033 , Online ISSN 2051-3305
- « Previous Article
- Table of contents
- Next Article »
In the present study, the authors demonstrate a complementary metal-oxide semiconductor (CMOS) image sensor implemented with on-chip polarisers using 65-nm standard CMOS technology. The polariser is composed of metal wire grids made of metal wires fabricated by the CMOS process. An extinction ratio of 18.8 dB was obtained for a single pixel with an on-chip polariser, where the line/space widths have the finest pitch obtainable by 65-nm technology. Electrical crosstalk between pixels is reduced by over 25% using a guard ring structure. Polarisation imaging by the sensor was also performed.
Inspec keywords: CMOS image sensors
Other keywords: CMOS image sensor; complementary metal-oxide semiconductor image sensor; electrical crosstalk; line-space widths; size 65 nm; guard ring structure; polarisation imaging; on-chip polarisers; metal wire grids
Subjects: Image detectors, convertors, and intensifiers; Image sensors
References
-
-
1)
-
3. Gruev, V., Spiegel, J.V.D., Engheta, N.: ‘Dual-tier thin film polymer polarization imaging sensor’, Opt. Express, 2010, 18, (18), pp. 19292–19303 (doi: 10.1364/OE.18.019292).
-
-
2)
-
4. Catrysse, P.B., Wandell, B.A.: ‘Integrated color pixels in 0.18-μm complementary metal oxide semiconductor technology’, JOSA A, 2003, 20, (12), pp. 2293–2306 (doi: 10.1364/JOSAA.20.002293).
-
-
3)
-
9. Shishido, S., Noda, T., Sasagawa, K., Tokuda, T., Ohta, J.: ‘Polarisation analysing image sensor with on-chip metal wire grid polariser in 65-nm standard complementary metal oxide semiconductor process’, Jpn. J. Appl. Phys., 2011, 50, (4), pp. 04DL01 (doi: 10.1143/JJAP.50.04DL01).
-
-
4)
-
11. Lin, D.L., Wang, C.C., Wei, C.L.: ‘Simulation and measurements of stray minority carrier protection structures in CMOS image sensors’, IEEE Trans. Electron Devices, 2010, 57, (9), pp. 2213–2220 (doi: 10.1109/TED.2010.2055275).
-
-
5)
-
2. Sarkar, M., Bello, D.S.S., Hoof, V.C., Theuwissen, A.: ‘Integrated polarisation analysing CMOS image sensor for material classification’, IEEE Sens., 2011, 11, (8), pp. 1692–1703 (doi: 10.1109/JSEN.2010.2095003).
-
-
6)
-
6. Huo, Y., Fesenmaier, C.C., Catrysse, P.B.: ‘Microlens performance limits in sub-2 μm pixel CMOS image sensors’, Opt. Express, 2010, 18, (6), pp. 5861–5872 (doi: 10.1364/OE.18.005861).
-
-
7)
-
7. Tokuda, T., Matsuoka, H., Tachikawa, N., et al: ‘CMOS sensor-based miniaturised in-line dual-functional optical analyser for high-speed in situ chirality monitoring’, Sens. Actuators B: Chem., 2013, 176, pp. 1032–1037 (doi: 10.1016/j.snb.2012.09.042).
-
-
8)
-
1. Tokuda, T., Yamada, H., Sasagawa, K., Ohta, J.: ‘Polarisation analysing CMOS image sensor with monolithically embedded polariser for microchemistry systems’, IEEE Trans. Biomed. Circuits Syst., 2009, 3, (5), pp. 259–266 (doi: 10.1109/TBCAS.2009.2022835).
-
-
9)
-
5. Gill, P.R., Lee, C., Lee, D.G., Wang, A., Molnar, A.: ‘A microscale camera using direct Fourier-domain scene capture’, Opt. Lett., 2011, 36, (15), pp. 2949–2951 (doi: 10.1364/OL.36.002949).
-
-
10)
- P.B. Catrysse , B.A. Wandell . Integrated color pixels in 0.18-µm complementary metal oxide semiconductor technology. J. Opt. Soc. Am. A , 12 , 2293 - 2306
-
11)
-
1. Tokuda, T., Matsuoka, H., Tachikawa, N., Wakama, N., Terao, K., Shibata, M., Noda, T., Sasagawa, K., Nishiyama, Y., Kakiuchi, K., Ohta, J.: ‘CMOS sensor-based miniaturized in-line dual-functional optical analyser for high-speed, in situ chirality monitoring’, Sens. Actuators B, Chem., 2012, 176, pp. 1032–1037 (doi: 10.1016/j.snb.2012.09.042).
-
-
12)
-
10. Ohta, J.: ‘Smart CMOS image sensors and applications’ (CRC Press, 2007).
-
-
13)
-
3. Gruev, V., Spiegel, J.V.D., Engheta, N.: ‘Dual-tier thin film polymer polarization imaging sensor’, Opt. Express, 2010, 18, (18), pp. 19292–19303 (doi: 10.1364/OE.18.019292).
-
-
14)
-
9. Shishido, S., Noda, T., Sasagawa, K., Tokuda, T., Ohta, J.: ‘Polarisation analysing image sensor with on-chip metal wire grid polariser in 65-nm standard complementary metal oxide semiconductor process’, Jpn. J. Appl. Phys., 2011, 50, (4), pp. 04DL01 (doi: 10.1143/JJAP.50.04DL01).
-
-
15)
-
5. Gill, P.R., Lee, C., Lee, D.G., Wang, A., Molnar, A.: ‘A microscale camera using direct Fourier-domain scene capture’, Opt. Lett., 2011, 36, (15), pp. 2949–2951 (doi: 10.1364/OL.36.002949).
-
-
16)
-
2. Sarkar, M., Bello, D.S.S., Hoof, V.C., Theuwissen, A.: ‘Integrated polarisation analysing CMOS image sensor for material classification’, IEEE Sens., 2011, 11, (8), pp. 1692–1703 (doi: 10.1109/JSEN.2010.2095003).
-
-
17)
-
6. Huo, Y., Fesenmaier, C.C., Catrysse, P.B.: ‘Microlens performance limits in sub-2 μm pixel CMOS image sensors’, Opt. Express, 2010, 18, (6), pp. 5861–5872 (doi: 10.1364/OE.18.005861).
-
-
18)
-
11. Lin, D.L., Wang, C.C., Wei, C.L.: ‘Simulation and measurements of stray minority carrier protection structures in CMOS image sensors’, IEEE Trans. Electron Devices, 2010, 57, (9), pp. 2213–2220 (doi: 10.1109/TED.2010.2055275).
-
-
19)
-
3. Tokuda, T., Yamada, H., Sasagawa, K., Ohta, J.: ‘Polarization-analyzing CMOS image sensor with monolithically embedded polarizer for microchemistry systems’, IEEE Trans. Biomed. Circuits Syst., 2009, 3, (5), pp. 259–266 (doi: 10.1109/TBCAS.2009.2022835).
-
-
20)
-
8. Wakama, N., Matsuoka, H., Ando, K., et al: ‘A polarisation analysing CMOS image sensor with metal wire grid in 65-nm standard CMOS technology’. Proc. Int. Meeting for Future of Electron Devices Kansai, May 2012, pp. 130–131, doi: 10.1109/IMFEDK.2012.6218616.
-
-
1)