Effects of interface conditions and long-term stability of passive intermodulation response in printed lines

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© The Institution of Engineering and Technology
Published 30/07/2012

Abstract

An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the self-improvement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

Inspec keywords: circuit stability; printed circuit design; intermodulation; microstrip lines

Other keywords: interface conditions; passive intermodulation response; surface bonding; printed microstrip lines; conductor-to-substrate interface; distributed passive intermodulation generation; long-term stability; custom-designed microwave laminates; printed circuits

Subjects: Printed circuit layout and design; Waveguides and microwave transmission lines

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