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Low-cost parametric test and diagnosis of RF systems using multi-tone response envelope detection

Low-cost parametric test and diagnosis of RF systems using multi-tone response envelope detection

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Because of aggressive technology scaling and multi-GHz operating frequencies of radio frequency (RF) devices, parametric failure test and diagnosis of RF circuitry is becoming increasingly important for the reduction of production test cost and faster yield ramp-up. A low-cost test and diagnosis method is proposed for multi-parametric faults in wireless systems that allows for the accurate prediction of the end-to-end specifications as well as the specifications of all the embedded RF modules. The procedure is based on application of an optimised test stimulus and extraction of its transient test response envelopes at RF signal nodes using a simple diode-based envelope detector. The test response is down-converted to lower frequencies compared to the operating frequency, thus eliminating the need to make RF measurements using expensive instrumentation. The specifications as well as the diagnostic information are computed from the test response of the envelope detector using statistical models. It is shown that the resulting information (features) in the transient envelope can accurately predict a host of test specifications using a single test configuration and test response capture event. Hardware measurement data from a 1.575 GHz transceiver shows that the test specifications of the system as well as the modules can be predicted with a high degree of accuracy using this method.

References

    1. 1)
      • J.W. Bandler , A.E. Salama . Fault diagnosis of analog circuits. Proc. IEEE , 8 , 1279 - 1325
    2. 2)
      • K.S. Kundert . Introduction to RF simulation and its application. IEEE J. Solid State Circ. , 9 , 1298 - 1319
    3. 3)
      • Valdes-Garcia, A., Venkatasubramanian, R., Srinivasan, R., Silva-Martinez, J., Sanchez-Sinencio, E.: `A CMOS RF RMS detector for built-in testing of wireless transceivers', Proc. VLSI Test Symp., May 2005, p. 249–254.
    4. 4)
      • Acar, E., Ozev, S.: `Diagnosis of the failing components in RF receivers through adaptive full-path measurements', Proc. VLSI Test Symp., May 2005, p. 374–379.
    5. 5)
      • Gopalan, A., Das, T., Washburn, C., Mukund, P.R.: `An ultra-fast, on-chip BiST for RF low noise amplifiers', Proc. Int. Conf., VLSI Design, Jan. 2005, p. 485–490.
    6. 6)
      • Kulhalli, S., Seth, S., Fu, S.: `An integrated linear RF power detector', Proc. ISCAS, 2004, p. I.625–I.628.
    7. 7)
      • A. Yin , W.R. Eisenstadt , R.M. Fox , T. Zhang . A translinear RMS detector for embedded test of RF ICs. IEEE Trans. Instrum. Measure. , 5 , 1708 - 1714
    8. 8)
      • M.S. Heutmaker , D.K. Le . An architecture for self-test of a wireless communication system using sampled IQ modulation and boundary scan. IEEE Commun. Mag. , 6 , 98 - 102
    9. 9)
      • J. Yoon , W.R. Eisenstadt . Embedded loopback test for RF ICs. IEEE Trans. Instrum. Measure. , 5 , 1715 - 1720
    10. 10)
      • J. Ferrario , R. Wolf , S. Moss , M. Slamani . A low-cost test solution for wireless phone RFICs. IEEE Commun. Mag. , 9 , 82 - 88
    11. 11)
      • Halder, A., Bhattacharya, S., Srinivasan, G., Chatterjee, A.: `A system-level alternate test approach for specification test of RF transceivers in loopback mode', Proc. Int. Conf., VLSI Design, Jan. 2005, p. 289–294.
    12. 12)
      • Acar, E., Ozev, S.: `Defect-based RF testing using a new catastrophic fault model', IEEE Int. Test Conf., Nov 2005, paper 17.3.
    13. 13)
      • Halder, A., Bhattacharya, S., Chatterjee, A.: `Automatic multitone alternate test generation for RF circuits using behavioural models', Proc. Int. Test Conf., Sept. 2003, p. 665–673.
    14. 14)
      • J.H. Friedman . Multivariate adaptive regression splines. Annals of Statistics , 1 , 1 - 141
    15. 15)
      • S. Bhattacharya , A. Chatterjee . Optimised wafer-probe and assembled package test design for analog circuits. ACM Trans. Design Autom. Electron. Syst. , 2 , 303 - 329
    16. 16)
      • P. Wang , S. Yang . A new diagnosis approach for handling tolerance in analog and mixed-signal circuits by using fuzzy math. IEEE Trans. Circuits Sys. I , 10 , 2118 - 2127
    17. 17)
      • C. Alippi , M. Catelani , A. Fort , M. Mugnaini . Automated selection of test frequencies for fault diagnosis in analog electronic circuits. IEEE Trans. Instrum. Measure. , 3 , 1033 - 1044
    18. 18)
      • Cherubal, S., Chatterjee, A.: `Parametric fault diagnosis for analog systems using functional mapping', Proc. Design, Automation and Test in Europe Conf. and Exhibition, March 1999, p. 195–200.
    19. 19)
      • Somayajula, S.S., Sanchez-Sinencio, E., Pineda de Gyvez, J.: `A power supply ramping and current measurement based technique for analog fault diagnosis', Proc. VLSI Test Symp., April 1994, p. 234–239.
    20. 20)
      • Voorakaranam, R., Cherubal, S., Chatterjee, A.: `A signature test framework for rapid production testing of RF circuits', Proc. Design Automation and Test in Europe Conf. and Exhibition, March 2002, p. 186–191.
    21. 21)
      • Bhattacharya, S., Chatterjee, A.: `Use of embedded sensors for built-in-test of RF circuits', Proc. Int. Test Conf., 2004, p. 801–809.
    22. 22)
      • J. Ryu , B.C. Kim , I. Sylla . A new low-cost RF built-in self-test measurement for system-on-chip transceivers. IEEE Trans. Instrum. Measure. , 2 , 381 - 388
    23. 23)
      • J. Dugundji . Envelope and pre-envelopes of real waveforms. IEEE Trans. Inform. Theory , 1 , 53 - 57
    24. 24)
      • P.N. Variyam , S. Cherubal , A. Chatterjee . Prediction of analog performance parameters using fast transient testing. IEEE Trans. Computer-Aided Design , 3 , 349 - 361
    25. 25)
      • Akbay, S.S., Chatterjee, A.: `Built-in test of RF components using mapped feature extraction sensors', Proc. VLSI Test Symp., May 2005, p. 243–248.
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