Physical-aware systematic multiple defect diagnosis

Po-Juei Chen; Chieh-Chih Che; James C.-M. Li; Shuo-Fen Kuo; Pei-Ying Hsueh; Chun-Yi Kuo; Jih-Nung Lee

Physical-aware systematic multiple defect diagnosis

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Author(s): Po-Juei Chen ¹ ; Chieh-Chih Che ¹ ; James C.-M. Li ¹ ; Shuo-Fen Kuo ² ; Pei-Ying Hsueh ² ; Chun-Yi Kuo ² ; Jih-Nung Lee ²
- Affiliations: 1: Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan;
  2: Design Technology Dept. DFT, Realtek Semiconductor Corp., Hsinchu, Taiwan
Source: Volume 8, Issue 5, September 2014, p. 199 – 209
DOI: 10.1049/iet-cdt.2013.0104 , Print ISSN 1751-8601, Online ISSN 1751-861X

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Received 12/07/2013, Accepted 17/02/2014, Revised 24/12/2013, Published 04/07/2014

This study presents a systematic defect diagnosis to identify ‘culprit physical features’ that are potentially responsible for yield loss. A ‘single location in-a-cluster’ technique is proposed to diagnose multiple defects that may not be diagnosed by traditional ‘single location at-a-time’ technique. A statistics technique, ‘analysis of variance’, is conducted to reduce noise from random defects. Simulations on five ISCAS'89 circuit demonstrate the effectiveness of the authors’ techniques. An experiment on an industrial design manufactured in 55 nm technology discovered a suspected culprit physical feature.

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