access icon free Study on effect of back oxide thickness variation in FDSOI MOSFET on analogue circuit performance

In this study, the analogue performance of radio-frequency (RF) range amplifiers and ring oscillators designed using fully depleted silicon on insulator (FDSOI) metal–oxide–semiconductor field-effect transistors (MOSFETs) is studied for different back oxide (BOX) thickness. The analysis exemplifies the need for BOX thickness variation analysis for the superior analogue/RF performance. The analogue parameters of the circuit analysed for different BOX thickness are the bandwidth, the linearity and the power consumption. The study shows that for an FDSOI MOSFET-based amplifier circuit, with increasing BOX thickness the bandwidth increases and the gain decreases. Also an optimum value of gain–bandwidth product for the amplifier is proposed considering the BOX thickness and the gate length of the device. It is also shown that frequency of oscillation for the ring oscillators increases with increasing BOX thickness.

Inspec keywords: analogue integrated circuits; radiofrequency amplifiers; logic gates; low-power electronics; MOSFET circuits; silicon-on-insulator

Other keywords: amplifier circuit; radiofrequency range amplifiers; fully depleted silicon on insulator; power consumption; FDSOI MOSFET; analogue circuit performance; oscillation frequency; ring oscillators; BOX thickness variation; Si; back oxide thickness variation; metal-oxide-semiconductor field-effect transistors; gain-bandwidth product

Subjects: Amplifiers; Electrical/electronic equipment (energy utilisation); Insulated gate field effect transistors; Analogue circuit design, modelling and testing; Logic circuits

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