Effect of etch holes on quality factor of bulk-mode micromechanical resonators

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Effect of etch holes on quality factor of bulk-mode micromechanical resonators

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A report is presented, for the first time, on the effect of release etch holes on the quality factors of bulk-mode micromechanical resonators. The bulk resonators were operated in the Lamé mode with frequencies around 6 MHz. Periodic 10 µm square etch holes with 30 µm spacing were placed at various locations on the surface of the resonator. A study on five such identical resonators with etch holes at various locations conclusively shows that etch holes decrease the quality factors by more than an order of magnitude from 1.67 million to 116 000 owing to two main energy loss mechanisms. Furthermore, it is demonstrated that the quality factor depends on the location of etch holes on the resonator.

Inspec keywords: micromechanical resonators; etching

Other keywords: energy loss mechanisms; size 10 mum; Lame mode; quality factor; bulk-mode micromechanical resonators; etch holes

Subjects: MEMS and NEMS device technology; Microsensors and nanosensors; Micromechanical and nanomechanical devices and systems

References

    1. 1)
      • Holmgren, O., Kokkonen, K., Kaajakari, V., Oja, A., Knuuttila, J.V.: `Direct optical measurement of the Q values of RF-MEMS resonators', Proc. IEEE Ultrasonics Symp., 2005, Rotterdam, The Netherlands, 4, p. 2112–2115.
    2. 2)
      • V. Kaajakari , T. Mattila , A. Oja , J. Kiihamäki , H. Seppä . Square-extensional mode single-crystal silicon micromechanical resonator for low phase noise oscillator applications. IEEE Electron Device Lett. , 4 , 173 - 175
    3. 3)
      • Rabinovich, V.L., Gupta, R.K., Senturia, S.D.: `The effect of release-etch holes on the electromechanical behavior of MEMS structures', Dig. Tech. Paprs, Transducers'97, 1997, Chicago, IL, USA, p. 1125–1128.
    4. 4)
    5. 5)
      • K. Miller, A. Cowen, G. Hames and B. Hardy: ‘SOIMUMPs design handbook’, MEMSCAP 2004.
    6. 6)
      • J. Carter , A. Cowen , B. Hardy , R. Mahadevan , M. Stonefield , S. Wilcenski . POLYMUMPs design handbook.
    7. 7)
      • Lynn, K., Palaniapan, M., Wai-Kin, W.: `12.9 MHz Lamé-mode differential SOI bulk resonators', Dig. Tech. Pprs, Transducers'07, 2007, Lyon, France, p. 1753–1756.
    8. 8)
      • H. Zhili , A. Erbil , F. Ayazi . An analytical model for support loss in micromechanical beam resonators with in-plane flexural vibrations. Sens. Actuators A , 156 - 164
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