Reduction of transmission line coupling effects in 2-20 GHz monolithic distributed amplifier

Access Full Text

Reduction of transmission line coupling effects in 2-20 GHz monolithic distributed amplifier

For access to this article, please select a purchase option:

Buy article PDF
£12.50
(plus tax if applicable)
Add to cart
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)
Add to cart

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

© The Institution of Electrical Engineers
Published

A novel decoupling technique has been applied to the gate and drain lines in a 2-20GHz monolithic distributed amplifier. In addition to flatter gain performance, the distributed amplifier with decoupling slots shows an increased bandwidth when compared to the same amplifier without the decoupling slots.

Inspec keywords: MMIC; field effect integrated circuits; transmission lines; microwave amplifiers; distributed parameter networks

Other keywords: monolithic distributed amplifier; HEMT MMIC; bandwidth; flatter gain performance; 2 to 20 GHz; transmission line coupling effects; decoupling technique

Subjects: Other field effect integrated circuits; Microwave integrated circuits; Amplifiers

References

    1. 1)
      • Finley, H.J.: `Accurate coupling predictions and assessments in MMIC networks', IEEE GaAs IC Symp. IEEE, 1983, New York, p. 16, 1983.
    2. 2)
      • M. Riaziat , S. Bandy , G. Zdasiuk . Coplanar waveguides for MMICs. Microwave J.
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19920329
Loading

Related content

content/journals/10.1049/el_19920329
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading